Tin (Sn) sputtering targets are solid metal source plates used in physical vapor deposition (PVD), most commonly magnetron sputtering. In this process, energetic ions bombard the target surface and eject tin atoms, which then condense onto a substrate to form a thin film. Tin is a post-transition metal with a long history in soldering, coatings, and alloy systems, and sputtering targets of this material serve as a controlled source for depositing pure tin films or, when used with reactive gases, tin-based compound films.
- Quantity: 1 piece
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- Research on lead-free solder and metallization layers for electronic interconnects
- Deposition of tin-based oxide thin films for transparent conductive coating studies
- Thin-film device prototyping in semiconductor and microelectronics laboratories
- Development of protective and functional coatings on glass and metal substrates
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