This tin (Sn) sputtering target from Nanografi has a purity of 99.99%, a size of 3'' and a thickness of 0.125''. It serves as the source material in sputter deposition, where atoms are eroded from the target and laid down as a thin film on a substrate such as a silicon wafer.
Sputtering works with many different materials and can coat substrates of various shapes and sizes. The process is repeatable, so work started in small R&D projects can be scaled up to production batches covering medium to large substrate areas.
Depending on the process parameters, chemical reactions can take place on the target surface, in flight or on the substrate. The number of adjustable parameters makes sputtering complex, but it also gives experienced users close control over film growth and microstructure.
- Deposition of thin tin films onto substrates such as silicon wafers.
- Sputter etching where high etching anisotropy is required and selectivity is not a concern.
- Material analysis by etching, as in secondary ion mass spectrometry (SIMS), to determine composition and detect very low impurity levels.
- Studies related to space weathering, in which sputtering alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.99% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01SN06
- Material: Tin (Sn)
- Size: 3''
- Thickness: 0.125''
- Product code: NG0ST01SN06
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