Tin (Sn) sputtering targets are solid metal target plates used in physical vapor deposition (PVD). In this process, energetic ions bombard the target surface and eject tin atoms, which then condense onto a substrate to form a thin film. As a metallic target material, tin is used in thin-film research where controlled, uniform metal layers are required.
- 1 piece
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- Deposition of tin-based thin films for electronic device prototyping
- Research on solder-compatible metallization layers
- Fabrication of metallic coatings for optical and surface studies
- Materials science investigations of alloy and multilayer thin films
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