Tin (Sn) sputtering targets are solid metal plates used as the source material in physical vapor deposition (PVD), particularly magnetron sputtering. Under ion bombardment, tin atoms are ejected from the target surface and deposited onto a substrate to form thin films. Tin is a post-transition metal widely studied for metallic coatings and alloy systems.
- 1 piece
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- Thin-film deposition research for metallic and alloy coatings
- Development of transparent conductive and electrode layers
- Solder-related metallization and interconnect studies
- Surface coating research for corrosion protection
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