Tin (Sn) sputtering targets are solid, dense discs or plates of elemental tin used as the source material in physical vapor deposition (PVD) sputtering systems. In a vacuum chamber, ions bombard the target and eject tin atoms that condense onto a substrate to form a thin film. As a metal sputtering target, tin is widely used in thin-film research and coating development.
- Quantity: 1 piece
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- Thin-film deposition research for solder and metallization layers
- Development of tin-based transparent conductive and oxide films
- Semiconductor and microelectronics process development
- Functional and protective coatings on glass and metal substrates
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