This titanium boride (TiB2) sputtering target from Nanografi is a 4'' target with a thickness of 0.250'' and a purity of 99.5%. It serves as the source material for sputter deposition, where material is eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Sputtering is an established thin film technique that works with many materials and with substrates of varied shapes and sizes. The process is repeatable, suits small research and development work, and can be scaled to production batches covering medium to large substrate areas.
Depending on the chosen process parameters, chemical reactions may take place at the target surface, in flight, or on the substrate. Although the number of parameters makes sputter deposition complex, it gives experienced users considerable control over film growth and microstructure.
- Deposition of thin films onto substrates such as silicon wafers.
- Sputter etching where highly anisotropic etching is required and selectivity is not critical.
- Analytical work in which target material is etched away, as in secondary ion mass spectrometry (SIMS) for determining composition and detecting trace impurities.
- Research related to space weathering, where sputtering alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.5% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01TI41
- Material: Titanium Boride (TiB2)
- Size: 4''
- Thickness: 0.250''
- Product code: NG0ST01TI41
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