This titanium carbide (TiC) sputtering target from Nanografi is a 2'' disc, 0.125'' thick, with a purity of 99.5%. It serves as the source material in sputter deposition systems, where atoms are eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Sputter deposition is an established way to coat substrates of many shapes and sizes with thin films. The process is repeatable and suits small research and development work, while also scaling up to production batches covering medium to large substrate areas.
Depending on the process parameters, chemical reactions may take place at the target surface, in flight or on the substrate. The large number of adjustable parameters makes sputtering a demanding technique, but it gives experienced users considerable control over film growth and microstructure.
- Thin film deposition by sputtering onto substrates such as silicon wafers.
- Sputter etching where highly anisotropic etching is required and selectivity is not critical.
- Material analysis techniques such as secondary ion mass spectrometry (SIMS), where sputtered atoms are identified and quantified to determine composition and trace impurities.
- Research related to space weathering, in which sputtering alters the physical and chemical properties of airless bodies like asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.5% |
| Category | — |
| Pack sizes | — |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01TI44
- Material: Titanium Carbide (TiC)
- Size: 2''
- Thickness: 0.125''
—
—