Titanium nitride (TiN) sputtering targets are solid source plates made from a hard ceramic compound of titanium and nitrogen. They are used in physical vapor deposition (PVD) processes, in which atoms are ejected from the target and deposited as a thin film onto a substrate. The product title also references indium, which may relate to the target's bonding or backing configuration.
- 1 piece
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- Thin-film deposition research on hard protective coatings
- Wear-resistant and decorative coating development
- Optical thin-film studies
- Diffusion barrier layer research in microelectronics
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