Titanium nitride (TiN) sputtering targets are ceramic source materials used in physical vapor deposition (PVD) to form thin films of titanium nitride. TiN belongs to the group of transition metal nitrides, which are widely studied for their hardness, electrical conductivity, and chemical stability. During sputtering, the target material is removed and deposited onto a substrate to build a uniform coating.
- Quantity: 1 piece
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- Hard protective coatings on cutting tools and wear-resistant components
- Decorative coatings with a gold-like appearance on consumer and architectural parts
- Diffusion barrier layers in thin-film and semiconductor device research
- Conductive and electrode layers in research on electronic and optical devices
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