This titanium nitride (TiN) sputtering target from Nanografi is a 3'' disc, 0.125'' thick, with a purity of 99.5%. It serves as the source material for sputter deposition, where atoms are eroded from the target and laid down as a thin film on a substrate such as a silicon wafer.
Sputtering is an established route to thin films and works on substrates of many shapes and sizes. Results are repeatable, so a process developed at research scale can be carried forward to production batches covering medium to large substrate areas. Depending on how the process is set up, chemical reactions may take place on the target surface, in flight or on the substrate itself.
Because sputter deposition involves many adjustable parameters, it gives experienced users considerable control over film growth and microstructure. Beyond coating, sputtering is also applied to anisotropic etching and to surface analysis techniques.
- Thin film deposition of titanium nitride onto substrates such as silicon wafers.
- Sputter etching where high etching anisotropy is required and selectivity is not critical.
- Compositional analysis by secondary ion mass spectrometry (SIMS), where material is sputtered at a constant rate and detected by mass spectrometry.
- Detection of very low impurity concentrations through sputter-based analysis.
- Research related to space weathering, the sputtering process that alters airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.5% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST02TI06
- Material: Titanium Nitride (TiN)
- Size: 3''
- Thickness: 0.125''
- Product code: NG0ST02TI06
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