This tungsten disulfide (WS2) sputtering target from Nanografi is a 3'' target, 0.125'' thick, with a purity of 99.9%. It serves as the source material for sputter deposition, where material is eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Sputtering is an established deposition method that works with many materials and with substrates of varied shapes and sizes. Processes are repeatable and can grow from small R&D work to production batches covering medium to large substrate areas. Depending on the process parameters, chemical reactions may take place on the target surface, in flight or on the substrate, and the many adjustable parameters give experienced users wide control over film growth and microstructure.
- Deposition of WS2 thin films onto substrates such as silicon wafers.
- Sputter etching where high etching anisotropy is required and selectivity is not a concern.
- Material analysis by etching, as in secondary ion mass spectrometry (SIMS), to determine composition and detect very low impurity levels.
- Research related to space weathering, where sputtering alters the surfaces of airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.9% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01TU34
- Material: Tungsten Disulfide (WS2)
- Size: 3''
- Thickness: 0.125''
- Product code: NG0ST01TU34
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