This tungsten disulfide (WS2) sputtering target from Nanografi is a 4'' target, 0.125'' thick, with a purity of 99.9%. It serves as the source material in sputter deposition, where material is eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Sputtering is an established route for coating substrates of many shapes and sizes. The process is repeatable, works for small research and development projects, and can be scaled to production batches covering medium to large substrate areas. Depending on process parameters, chemical reactions may take place at the target surface, in flight or on the substrate.
Because sputter deposition involves many adjustable parameters, it gives experienced users considerable control over film growth and microstructure.
- Thin film deposition of WS2 onto substrates such as silicon wafers.
- Sputter etching where high etching anisotropy is required and selectivity is not a concern.
- Material analysis techniques such as secondary ion mass spectrometry (SIMS), where sputtered atoms are identified and quantified to determine composition and trace impurities.
- Research related to space weathering, in which sputtering alters the surfaces of airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.9% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01TU36
- Material: Tungsten Disulfide (WS2)
- Size: 4''
- Thickness: 0.125''
- Product code: NG0ST01TU36
—
—