This tungsten oxide (WO3) sputtering target from Nanografi is a 4'' disc, 0.125'' thick, with a purity of 99.9%. It serves as the source material in sputter deposition systems, where atoms are eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Sputtering is an established deposition route that coats substrates of many shapes and sizes. The process is repeatable, works for small research and development projects, and can be scaled to production batches covering medium to large substrate areas. Depending on the process parameters, chemical reactions may take place on the target surface, in flight or on the substrate. Because so many parameters can be tuned, experienced users gain considerable control over film growth and microstructure.
Besides film deposition, sputter targets are also used in sputter etching and in analytical techniques that remove material from a target in a controlled way.
- Thin film deposition of tungsten oxide onto substrates such as silicon wafers.
- Sputter etching where highly anisotropic etching is required and selectivity is not critical.
- Composition analysis such as secondary ion mass spectrometry (SIMS), where sputtered atoms are identified by mass spectrometry to detect even very low impurity levels.
- Scalable coating work, from research and development projects to production batches on medium to large substrate areas.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.9% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01TU49
- Material: Tungsten Oxide (WO3)
- Size: 4''
- Thickness: 0.125''
- Product code: NG0ST01TU49
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