This tungsten oxide (WO3) sputtering target from Nanografi is a 4'' target with a thickness of 0.250'' and a purity of 99.9%. It serves as the source material in sputter deposition, where material is eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Sputtering is an established deposition method that works with many materials and with substrates of different shapes and sizes. Results are repeatable, and a process developed in small research projects can be scaled to production batches covering medium to large substrate areas.
Depending on the process parameters, chemical reactions may take place at the target surface, in flight or on the substrate. The many adjustable parameters make sputter deposition complex, but they give experienced users considerable control over film growth and microstructure.
- Deposition of thin films onto substrates such as silicon wafers.
- Sputter etching where strongly anisotropic etching is required and selectivity is not critical.
- Materials analysis by etching, as in secondary ion mass spectrometry (SIMS), to determine composition and detect very low impurity levels.
- Research related to space weathering, the sputtering process that alters the surfaces of airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.9% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01TU50
- Material: Tungsten Oxide (WO3)
- Size: 4''
- Thickness: 0.250''
- Product code: NG0ST01TU50
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