Tungsten Titanium (TiW) sputtering targets are solid metal-alloy sources made from a combination of tungsten and titanium. They are used in physical vapor deposition (PVD) systems, where the target is bombarded with ions so that its atoms are ejected and deposited as a thin film onto a substrate. TiW belongs to the group of refractory metal alloys, valued for its stability and mechanical strength at high temperatures.
- Quantity: 1 piece
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- Diffusion barrier layers in thin-film and microelectronic device research
- Adhesion and interlayer coatings for metallization studies
- Protective and wear-resistant thin-film coatings for industrial R&D
- Electrode and contact layer development for electronic components
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