Tungsten Titanium (TiW) sputtering targets are solid source plates used in physical vapor deposition (PVD) to produce thin films by sputtering. TiW is a tungsten-titanium material from the metal and alloy target group, valued in thin-film processing for its stability during deposition.
- Quantity: 1 piece
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- Diffusion barrier layers in semiconductor and microelectronic metallization
- Thin-film deposition for electronic device research and development
- Adhesion and interlayer films in multilayer coating studies
- Protective and functional thin coatings for laboratory and industrial testing
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