Tungsten titanium (TiW) is a metallic alloy of tungsten and titanium, supplied as a sputtering target for physical vapor deposition (PVD). Sputtering targets are solid source materials that release atoms onto a substrate to form thin films. TiW belongs to the refractory metal alloy group and is valued for its thermal stability and barrier properties.
- Quantity: 1 piece
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- Diffusion barrier layers in semiconductor metallization
- Adhesion layers for metal thin-film stacks
- Thin-film research on refractory metal coatings
- Protective and barrier coating development in laboratory settings
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