Tungsten titanium (TiW) sputtering targets are solid source materials used in physical vapor deposition (sputtering) to produce thin films. TiW is a metal alloy of tungsten and titanium, valued in research for its barrier and adhesion properties in layered thin-film structures.
- Quantity: 1 piece
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- Diffusion barrier layers in semiconductor metallization research
- Adhesion and barrier layers for thin-film interconnect studies
- Protective and functional thin-film coating development
- Materials research on metal alloy thin films
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