This tungsten titanium (TiW) sputtering target from Nanografi is a 3'' disc, 0.125'' thick, with a purity of 99.99%. It serves as the source material in sputter deposition, where material is eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Sputtering is an established way to coat substrates of many shapes and sizes. The process is repeatable, so work started in small research and development projects can be scaled to production batches covering medium to large substrate areas. Depending on process settings, chemical reactions may take place at the target surface, in flight or on the substrate. The large number of adjustable parameters makes the method complex, but it gives experienced users fine control over film growth and microstructure.
- Deposition of thin films onto substrates such as silicon wafers.
- Sputter etching where strong etching anisotropy is required and selectivity is not a concern.
- Material analysis by etching, for example in secondary ion mass spectrometry (SIMS) to determine composition and detect very low impurity levels.
- Research related to space weathering, where sputtering alters the surfaces of airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.99% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01TU67
- Material: Tungsten Titanium (TiW)
- Size: 3''
- Thickness: 0.125''
- Product code: NG0ST01TU67
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