This tungsten titanium (TiW) sputtering target is a 3'' disc, 0.250'' thick, with a purity of 99.99%. It serves as the source material in sputter deposition systems, where atoms are eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Sputtering is an established route to thin films from many materials and works on substrates of varied shapes and sizes. The process is repeatable, so work started in small R&D projects can be carried over to production batches covering medium to large substrate areas.
Depending on the process parameters, chemical reactions can take place at the target surface, in flight or on the substrate. Because so many parameters can be adjusted, sputtering gives experienced users close control over film growth and microstructure.
- Deposition of TiW thin films onto substrates such as silicon wafers.
- Sputter etching where a high degree of etching anisotropy is required and selectivity is not a concern.
- Scaling thin film processes from research and development work to medium and large production batches.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.99% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01TU68
- Material: Tungsten Titanium (TiW)
- Size: 3''
- Thickness: 0.250''
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