Tungsten titanium (TiW) sputtering targets are solid metal alloy targets from the tungsten-titanium system, used as the source material in physical vapor deposition (PVD) to form thin films. During sputtering, energetic ions eject atoms from the target surface, which then condense onto a substrate. This makes TiW targets a common choice for depositing tungsten-titanium layers in thin-film research and development.
- Quantity: 1 piece
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- Diffusion barrier layers in semiconductor metallization studies
- Adhesion and barrier layers in multilayer thin-film stacks
- Electrode and interconnect layer development in microelectronics research
- Protective and functional coating experiments on laboratory substrates
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