Tungsten Titanium (TiW) sputtering targets are solid metal alloy sources made from a combination of tungsten and titanium. They are designed for physical vapor deposition (PVD), where high-energy ions eject atoms from the target surface to form thin films on a substrate. TiW is classified as a refractory metal alloy, valued for its thermal stability and its ability to act as a barrier between layers.
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- Diffusion barrier layers in semiconductor and microelectronic metallization
- Adhesion layers between metal and dielectric films in thin-film devices
- Protective and wear-resistant coatings in research on hard thin films
- Thin-film resistor and interconnect development in laboratory prototyping
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