This tungsten titanium (TiW) sputtering target is a 6'' disc-format source with 99.99% purity and a thickness of 0.125''. It is supplied as a single piece for physical vapour deposition systems that grow thin films on substrates such as silicon wafers.
Sputter deposition works by eroding material from the target and transferring it onto the substrate. The method suits many substrate shapes and sizes, gives repeatable results and can move from small research and development work to production batches covering medium to large substrate areas. Depending on process parameters, chemical reactions may take place at the target surface, in flight or on the substrate, and these many variables give experienced users fine control over film growth and microstructure.
Beyond coating, sputtering is also used for anisotropic etching and for analytical techniques that remove material at a controlled rate.
- Deposition of TiW thin films onto substrates such as silicon wafers.
- Sputter etching in semiconductor processing where high etching anisotropy is required and selectivity is not critical.
- Material analysis such as secondary ion mass spectrometry (SIMS), where sputtered atoms are identified to determine composition and trace impurities.
- Research and development work that can be scaled up to production batches on medium to large substrate areas.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.99% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01TU71
- Material: Tungsten Titanium (TiW)
- Size: 6''
- Thickness: 0.125''
- Product code: NG0ST01TU71
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