Tungsten titanium (TiW) is a metal alloy combining tungsten and titanium. It is supplied as a sputtering target, a solid source material used in physical vapor deposition (PVD). During sputtering, the target is bombarded with energetic ions, which eject atoms that condense onto a substrate to form a thin film.
- 1 piece
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- Diffusion barrier layers in semiconductor and microelectronic device research
- Metallization and contact layers for thin-film electronic studies
- Functional and protective coatings in materials science investigations
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