Tungsten titanium (TiW) is a metallic alloy of tungsten and titanium supplied as a sputtering target, a solid source material used in physical vapor deposition (PVD) to form thin films on substrates. It belongs to the group of refractory metal alloys, which are generally valued for their thermal stability and mechanical robustness in thin-film processes.
- Quantity: 1 piece
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- Diffusion barrier layers in semiconductor metallization research
- Adhesion and interlayer films for multilayer thin-film device fabrication
- Protective and functional coating studies on laboratory substrates
- Sputter deposition process development in university and industrial laboratories
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