Tungsten (W) sputtering targets are solid metal plates used as the source material in physical vapor deposition (PVD) sputtering processes. Tungsten belongs to the refractory metal group, known for its mechanical robustness and high-temperature stability. During sputtering, energetic ions eject atoms from the target surface, which then condense onto a substrate to form a uniform thin film.
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- Diffusion barrier and interconnect layer studies in thin-film electronics research
- Protective and hard coating development in materials science
- Optical and decorative thin-film research
- Deposition process development in university and industrial laboratories
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