Tungsten (W) sputtering targets are solid metal plates used in physical vapor deposition (PVD). In a sputtering process, energetic ions strike the target surface and eject tungsten atoms that condense onto a substrate to form a thin film. Tungsten belongs to the refractory metal group, known for its high melting point and robust mechanical behavior, which makes it a common choice for thin-film research.
- 1 piece
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- Deposition of tungsten thin films for electronics and microfabrication research
- Development of hard and wear-resistant coatings for tools and components
- Studies of diffusion barrier and interconnect layers in semiconductor processing
- Experimental coatings for optical and X-ray related applications
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