Tungsten (W) sputtering targets are solid metal sources used in physical vapor deposition (PVD) to produce thin films. Tungsten is a refractory metal, a material group known for high melting points and mechanical robustness. Sputtering targets are bombarded with ions in a vacuum chamber, releasing atoms that condense onto a substrate to form a uniform coating.
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- Thin-film deposition research for electronic and microelectronic devices
- Development of diffusion barrier and metallization layers
- Wear-resistant and hard coating studies
- Optical and surface-engineering coating prototypes
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