This tungsten (W) sputtering target from Nanografi is a 4'' target with a thickness of 0.250'' and a purity of 99.95%. It serves as the source material in sputter deposition systems, where atoms are eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Sputtering is an established thin film technique that works with many materials and with substrates of different shapes and sizes. The process is repeatable, so work started in small research and development projects can be scaled up to production batches covering medium to large substrate areas.
Depending on the process parameters, chemical reactions may take place at the target surface, in flight or on the substrate. Although the large number of parameters makes sputter deposition complex, it gives experienced users considerable control over film growth and microstructure.
- Deposition of tungsten thin films onto substrates such as silicon wafers.
- Sputter etching where a high degree of etching anisotropy is required and selectivity is not a concern.
- Materials analysis by etching away target material, as in secondary ion mass spectrometry (SIMS) for determining composition and detecting very low impurity levels.
- Studies related to space weathering, in which sputtering alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.95% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01TU08
- Material: Tungsten (W)
- Size: 4''
- Thickness: 0.250''
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