Tungsten (W) sputtering targets are solid metal plates used as the source material in physical vapor deposition (PVD), particularly magnetron sputtering. During the process, ions bombard the target surface and eject tungsten atoms that condense onto a substrate to form a thin film. Tungsten is a refractory transition metal, and this product belongs to the metal sputtering target group commonly used in thin film research and development.
- Quantity: 1 piece
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- Deposition of tungsten and tungsten-based thin films for microelectronics research
- Diffusion barrier and contact layer studies in semiconductor device fabrication
- Development of hard, wear-resistant coatings on tools and components
- Thin film studies for optical and electrical functional layers
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