Tungsten (W) sputtering targets are solid metal plates used as the source material in physical vapor deposition (PVD) sputtering systems. Tungsten is a refractory transition metal valued for its high-temperature stability, hardness, and chemical resistance. During sputtering, energetic ions bombard the target surface, ejecting tungsten atoms that condense onto a substrate to form thin films. This product falls within the metal sputtering target category commonly used in thin-film research and development.
- Quantity: 1 piece
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- Thin-film interconnects and diffusion barrier layers in microelectronics research
- Hard protective coatings for wear-resistance studies
- Optical and functional thin films in materials science laboratories
- Thin-film device prototyping and process development
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