This zinc (Zn) sputtering target from Nanografi is a 3'' target with a thickness of 0.250'' and a purity of 99.95%. It serves as the source material in sputter deposition systems, where zinc is eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Sputtering is an established method for coating substrates of many shapes and sizes. The process is repeatable and scales from small R&D work to production batches covering medium to large substrate areas. Depending on process parameters, chemical reactions may take place at the target surface, in flight or on the substrate, and the many adjustable parameters give experienced users close control over film growth and microstructure.
Beyond deposition, sputtering is also used for etching where high anisotropy is required and selectivity is not critical, and for surface analysis techniques such as secondary ion mass spectrometry (SIMS).
- Thin film deposition of zinc onto substrates such as silicon wafers.
- Sputter etching where a high degree of anisotropy is needed and selectivity is not a concern.
- Compositional analysis by SIMS, where material is sputtered at a constant rate and measured by mass spectrometry.
- Scaling deposition processes from research projects to medium and large area production batches.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.95% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01ZN20
- Material: Zinc (Zn)
- Size: 3''
- Thickness: 0.250''
- Product code: NG0ST01ZN20
—
—